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MERCURY SRL

MERCURY SRL

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MERCURY SRL

Innovative hardware solutions for your semiconductor fab

 

 


 

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From robot arm assemblies to robotic and chamber component upgrades to hub refurbishments, Fabworx offers an array of products and services for 300mm, 200mm, and 150mm CVD, PVD, Epi, Etch, and RTP process groups.

 

Robots

 


 

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Fabpro 2.0 and Top Mount Hub Plate

 

For 300mm and 200mm

 

The Fabpro 2.0 robot provides significant improvements in lifetime, repeatability, and particle protection over the 300mm and 200mm OEM Producer SE robot. Enhanced blade leveling and Z-axis adjustments, enclosed, precision bearings and components, and substantial weight reduction result in a longer lasting robot with reduced maintenance needs, greater accuracy, and minimized installation time.

​The Fabworx Top Mount Hub Plate allows customers to remove the VHP hub assembly from the top of the tool mainframe without needing to crawl underneath the tool, reducing downtime, tool damage, and danger to engineers and technicians. The Top Mount Hub Plate can be used with the Fabpro 2.0 or the OEM Producer robot.

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Fabht 300

 

For 300mm

 

The Fabht 300 robot increases accuracy, placement repeatability, and robot lifetime, while reducing robot droop, particle contamination, and side-to-side movement during Epi and RTP processes. The Fabht 300 utilizes pressed-fit bearings, precision-machined components, particle containment designs, and various other improvements to provide substantial upgrades over the OEM robot.

 

The Fabht 300 allows easier, faster installations and setups due to independent pitch, roll, and Z-axis adjustment capabilities at the hub connection.

Components

Refurbishments

 


 

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Endurance Suite

 

For 300mm

 

Fabworx offers a series of upgrades to the Endura mainframe that reduce particle generation and increase yield. These include Elbow Hard Stops for the XP robot that prevent wrist—spool adaptor scratching during maintenance, a reengineered Degas Lift Hoop that eliminates hoop warping and associated particle generation, improved SWLL Fins that reduce wafer movement and scratching during pump down, and Chamber A & B and PVD Chamber Lift Pins that eliminate backside wafer scratching.